Normal view MARC view ISBD view

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces - High Performance Compute and System-in-Package

Beth Keser

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces - High Performance Compute and System-in-Package - Wiley 2021

ISBN: 9781119793908

Source: EBOOK

Place hold
Place recall
Print
Cite
Add to your cart (remove)
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)