Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package

Material type: TextLanguage: English Publication details: IEEE; 2022Other classification:
Online resources:
Item type: eBooks
Tags from this library: No tags from this library for this title. Log in to add tags.
Star ratings
    Average rating: 0.0 (0 votes)
Holdings
Cover image Item type Current library Home library Collection Shelving location Call number Materials specified Vol info URL Copy number Status Notes Date due Barcode Item holds Item hold queue priority Course reserves
eBooks Central Library Central Library Available CL2122512

There are no comments on this title.

to post a comment.
Previous
Back to results
Next
Close
Copyright @ Delhi University Library System