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| 005 | 20260121114201.0 | ||
| 008 | 008 260114s9999 xx 000 0 eng d | ||
| 020 | _a9781119793908 | ||
| 037 | _aEBOOK | ||
| 040 | _aCRL | ||
| 040 | _beng | ||
| 040 | _cCRL | ||
| 041 | _2eng | ||
| 041 | _aeng | ||
| 084 | _qCRL | ||
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_aBeth Keser _9971879 |
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| 245 | 0 | _aEmbedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces - High Performance Compute and System-in-Package | |
| 260 | _bWiley | ||
| 260 | _c2021 | ||
| 856 | _uhttps://onlinelibrary.wiley.com/doi/book/10.1002/9781119793908 | ||
| 942 | _cEBOOK | ||
| 999 |
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