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| 100 | _aLi | ||
| 245 | 0 | _aElectrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC | |
| 260 | _bIEEE | ||
| 260 | _c2012 | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?bknumber=6183551 | ||
| 942 | _cEBOOK | ||
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