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037 _aEBOOK
040 _aCRL
040 _beng
040 _cCRL
041 _2eng
041 _aeng
084 _qCRL
245 0 _aThermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices
260 _bIEEE
856 _uhttps://ieeexplore.ieee.org/servlet/opac?bknumber=10529558
942 _cEBOOK
999 _c1720282
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