| 000 | 00707nam a2200277Ia 4500 | ||
|---|---|---|---|
| 005 | 20260324115543.0 | ||
| 008 | 008 260324s9999 xx 000 0 eng d | ||
| 020 | _a9781315305875 | ||
| 037 | _aEBOOK | ||
| 040 | _aCRL | ||
| 040 | _beng | ||
| 040 | _cCRL | ||
| 041 | _2eng | ||
| 041 | _aeng | ||
| 084 | _qCRL | ||
| 100 |
_aXing-Chang Wei _91155114 |
||
| 245 | 0 | _aModeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging | |
| 260 | _bTaylor and Francis | ||
| 260 | _c2017 | ||
| 365 | _a | ||
| 365 | _b260 | ||
| 856 | _uhttp://www.taylorfrancis.com/books/9781315305875 | ||
| 942 | _cEBOOK | ||
| 999 |
_c1746076 _d1746076 |
||