| 000 | 00760nam a2200277Ia 4500 | ||
|---|---|---|---|
| 005 | 20260324140722.0 | ||
| 008 | 008 260324s9999 xx 000 0 eng d | ||
| 020 | _a9781315214153 | ||
| 037 | _aEBOOK | ||
| 040 | _aCRL | ||
| 040 | _beng | ||
| 040 | _cCRL | ||
| 041 | _2eng | ||
| 041 | _aeng | ||
| 084 | _qCRL | ||
| 100 |
_aMichael Pecht; Rakish Agarwal; F. Patrick McCluskey; Michael Pecht; Sirus Javadpour; Rahul Mahajan; Terrance J. Dishongh _91205476 |
||
| 245 | 0 | _aElectronic Packaging Materials and Their Properties | |
| 260 | _bTaylor and Francis | ||
| 260 | _c1998 | ||
| 365 | _a | ||
| 365 | _b340 | ||
| 856 | _uhttp://www.taylorfrancis.com/books/9781315214153 | ||
| 942 | _cEBOOK | ||
| 999 |
_c1807827 _d1807827 |
||